PACK EXPO INTERNATIONAL 2018


INVITATION


PACK EXPO INTERNATIONAL 2018 


Techik Instrument (Shanghai) Co., Ltd will attend the PACK EXPO INTERNATIONAL 2018, Oct. 14-17, Chicago, IL USA.


We are looking forward to your visit and test the machine in person.


Your satisfaction is our top concern.


Techik Booth No.:E-9423


Date:14-17 October 2018


MCCORMICK PLACE ,CHICAGO, IL USA